人工情报 芯片市场 QQ大小,统计,股份 [2022-2030]

人工情报 芯片市场XQ大小、共享和趋势分析,按芯片类型{GPU、应用程序特定集成电路(ASIC)、外地可编程门阵列(FPCA'S)、神经网络处理(NNP)等}、计算机类型(云和边缘计算)、应用程序(机器学习、计算机视野、机器人进程自动化、背景----了解计算、预测分析和自然语言进程)、功能(培训和接口)、终端用户行业(媒体和广告)、BFSI(银行、金融服务和保险)、IT和电信、零售、保健、汽车和运输、农业和国防)区域,预测期2022-2030年

报告编号 : RI_673745 | 上次更新 : November 2024 | 格式 : ms word ms Excel PPT PDF

本报告包含最新的市场数据、统计和数据
Table of Content

1.Introduction

1.1. Market Introduction
1.2. Market Research Methodology
1.2.1. Research Process
1.2.2. Primary Research
1.2.3. Secondary Research
1.2.4. Data Collection Technique
1.2.5. Data Sources
1.3. Market Estimation Methodology
1.3.1. Limitations Of The Study
1.4. Product Picture Of Insulated Gate Bipolar Transistors
1.5. Global Discrete Semiconductor: Classification
1.6. Geographic Scope
1.7. Years Considered For The Study
1.8. Research Methodology In Brief
1.9. Parent Market Overview
1.10. Overall Artificial Intelligence Chip Market Regional Demand
1.11. Research Programs/Design
1.12. Market Breakdown And Data Triangulation Approach
1.13. Data Source
1.14. Secondary Sources
1.15. Primary Sources
1.16. Primary Interviews
1.17. Average Primary Breakdown Ratio

2. Market Dynamics

2.1. Drivers
2.1.1. Drivers
2.2. Restraints
2.2.1. Restraints
2.3. Opportunity
2.3.1. Impact Forces On Market Dynamics
2.3.2. Impact Forces During The Forecast Years
2.4. Industry Value Chain
2.4.1. Upstream Analysis
2.4.2. Downstream Analysis
2.4.3. Distribution Channel
2.4.4. Direct Channel
2.4.5. Indirect Channel
2.5. Potential Customers
2.6. Manufacturing/Operational Cost Analysis
2.7. Pricing Analysis By Region
2.8. Key Technology Landscape
2.9. Regulatory Analysis
2.10. Porter\'s Analysis
2.10.1. Supplier Power
2.10.2. Buyer Power
2.10.3. Substitution Threat
2.10.4. Threat From New Entry
2.10.5. Competitive Rivalry
2.11. Pestle Analysis
2.12. Political Factors
2.13. Economic Factors
2.14. Social Factors
2.15. Technological Factor
2.16. Environmental Factors
2.17. Legal Factors

3. Global Artificial Intelligence Chip Market Segmentation, Revenue (USD Billion), (2022-2030)

3.1. By CHIPSET TYPE
3.1.1. Graphic PROCESSING UNIT (GPU)
3.1.2. Application SPECIFIC INTEGRATED Circuits (ASIC)
3.1.3. Field PROGRAMMABLE Gate Arrays (FPCA\'s)
3.1.4. Neural NETWORK PROCESSING (NNP)
3.1.5. Others
3.2. By COMPUTING Type
3.2.1. Cloud
3.2.2. Edge
3.3. By Application
3.3.1. Machine LEARNING
3.3.2. Computer VISION
3.3.3. Robotic PROCESS AUTOMATION
3.3.4. Context - AWARE COMPUTING
3.3.5. Predictive ANALYSIS
3.3.6. Natural LANGUAGE PROCESS
3.4. By FUNCTION
3.4.1. Training
3.4.2. Interface
3.5. By END-USER INDUSTRY
3.5.1. Media And Advertising
3.5.2. BFSI
3.5.3. It And Telecom
3.5.4. Retail
3.5.5. Healthcare
3.5.6. Automotive AND Transportation
3.5.7. Agriculture
3.5.8. Defense

4. Global Artificial Intelligence Chip Market Overview, By Region

4.1. North America Market Revenue (USD Billion), By Countries, (2022-2030)
4.1.1. Us
4.1.1.1. By CHIPSET TYPE
4.1.1.2. By COMPUTING Type
4.1.1.3. By Application
4.1.1.4. By FUNCTION
4.1.1.5. By END-USER INDUSTRY
4.1.2. Canada
4.1.3. Mexico
4.2. Europe Market Revenue (USD Billion), By Countries, (2022-2030)
4.2.1. Germany
4.2.2. France
4.2.3. UK
4.2.4. Spain
4.2.5. Russia
4.2.6. Italy
4.2.7. Benelux
4.3. Asia Pacific Market Revenue (USD Billion), By Countries, (2022-2030)
4.3.1. China
4.3.2. Japan
4.3.3. Australia
4.3.4. South Korea
4.3.5. India
4.3.6. ASEAN
4.4. Latin America Market Revenue (USD Billion), By Countries, (2022-2030)
4.4.1. Brazil
4.4.2. Argentina
4.4.3. Chile
4.5. Middle East And Africa Market Revenue (USD Billion), By Countries, (2022-2030)
4.5.1. GCC
4.5.2. Turkey
4.5.3. South Africa

5. Global Artificial Intelligence Chip Market Revenue: Competitive Analysis, 2021

5.1. Key Strategies By Players
5.2. Revenue (UAD Billion And %), By Manufacturers, 2021
5.3. Player Positioning By Market Players, 2021

6. Competitive Analysis

6.1. NVidia
6.1.1. Business Overview
6.1.2. Business Financials (USD Billion)
6.1.3. Product Category, Type, And Specification
6.1.4. Main Business/Business Overview
6.1.5. Geographical Analysis
6.1.6. Recent Development
6.1.7. Swat Analysis
6.2. Microsemi Corporation,
6.3. Mythic, Inc.,
6.4. Nec Corporation,
6.5. Korea Electronic Certification Authority, Inc.
6.6. Nxp Semiconductors N.V.,
6.7. Qualcomm Incorporated,
6.8. Samsung Electronics Co. Ltd.,
6.9. Shanghai Think-Force Electronic Technology Co.
6.10. Sk Hynix, Inc.,
6.11. Softbank Group Corp. (Arm Holdings Plc),
6.12. Taiwan Semiconductor Manufacturing Company
6.13. Tenstorrent Inc.,
6.14. Texas Instruments Incorporat

7.Market Research Findings & Conclusion

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