High-Speed Board-to-Board Connectors Market (Updated Version Available)

High-Speed Board-to-Board Connectors Market 2020 by Manufacturers, Regions (Europe, Asia Pacific, North America and South America), Type, Application And Forecast to 2025

Report ID : RI_93925 | Date : July 2020 | Format : ms word ms Excel PPT PDF

This Report Includes The Most Up-To-Date Market Figures, Statistics & Data
Board-to-board (BTB) connectors are used to connect printed circuit boards (PCB), electronic components that contain a conductive pattern printed on the surface of the insulating base in an accurate and repeatable manner. Each terminal on a BTB connector is connected to a PCB. A BTB connector includes housing and a specific number of terminals. The terminal is made from a conductive material (mostly copper alloy), and plated to improve conductivity and antirust. Terminals transmit the current/signal between PCBs connected by BTB; the housing is made of insulating material (mostly plastic).
North America, Europe and China are major regions produce Board-to-board Connectors in the world, accounting for more than 66% of the world. APAC dominates the global demand market for Board-to-board Connectors and the trend is anticipated to continue for a foreseeable future. APAC is expected to account for the largest share of the global Board-to-board connector market in 2017. The demand for industrial Internet of Thing is high in the APAC region with special focus on process automation. In countries such as Japan and China where the automobile market has opportunities supported by electric vehicles, the consumption of connectors is high. The APAC region is a huge hub for consumer electronics market which in turn increases the demand for connectors in this region.
In 2020, the market size of High-Speed Board-to-Board Connectors is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2020; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
In this report, 2019 has been considered as the base year and 2020 to 2025 as the forecast period to estimate the market size for High-Speed Board-to-Board Connectors.

This report studies the global market size of High-Speed Board-to-Board Connectors, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
This study presents the High-Speed Board-to-Board Connectors production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2020, and forecast to 2025.
For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2020.

In global market, the following companies are covered:
TE Connectivity
Samtec
Amphenol
Molex
Fujitsu
Hirose Electric
JST
Joint Admissions Exercise (JAE)
Delphi
Harting
Foxconn
ERNI Electronics
Kyocera
Yamaichi Electronics
Advanced Interconnect
Unimicron Technology

Market Segment by Product Type
<1.00 mm
1.00 mm-2.00 mm
> 2.00 mm

Market Segment by Application
Transportation
Consumer Electronics
Communications
Industries
Military
Other

Key Regions split in this report: breakdown data for each region.
United States
China
European Union
Rest of World (Japan, Korea, India and Southeast Asia)

The study objectives are:
To analyze and research the High-Speed Board-to-Board Connectors status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
To present the key High-Speed Board-to-Board Connectors manufacturers, presenting the sales, revenue, market share, and recent development for key players.
To split the breakdown data by regions, type, companies and applications
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market

In this study, the years considered to estimate the market size of High-Speed Board-to-Board Connectors are as follows:
History Year: 2014-2019
Base Year: 2019
Estimated Year: 2020
Forecast Year 2020 to 2025
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